Nanofabrication Internship H/F
Alice & Bob
Aubervilliers, France
Posted on Apr 17, 2026
Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!
We're a diverse team of 140+ brilliant minds from over 20 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!
Are you interested in hands-on nanofabrication and eager to work in a cleanroom environment on real device integration challenges?
This internship offers the opportunity to contribute directly to the deployment of a new flip-chip bonding capability in our fabrication facility. You will participate in developing and optimizing fabrication processes used to assemble advanced microelectronic devices. If you are curious, rigorous, and motivated to learn practical cleanroom techniques, you will thrive in this role while joining the nanofabrication team at Alice & Bob.
In this internship, you will support the development of a new flip-chip bonding process using our new upcoming tool. Your work will focus on optimizing optical lithography and metal deposition processes used to fabricate indium bumps, followed by testing bonding performance and evaluating chip planarity.
This role directly contributes to enabling reliable device integration and improving the reproducibility of advanced fabrication processes in our cleanroom.
Responsibilities:
At Alice & Bob you will:
• Develop and optimize an optical lithography process to pattern indium bump structures
• Participate in metal deposition and lift-off processes for bump fabrication
• Measure and characterize bump geometry (height, diameter, uniformity)
• Perform flip-chip bonding tests using the new bonding system
• Evaluate bonding quality and verify chip planarity and alignment
• Document process parameters, experimental results, and fabrication workflows
• Contribute to improving process reliability and reproducibility
Requirements:
- Understanding of microfabrication processes
- Ability to follow experimental procedures and document results
- Interest in hands-on laboratory or cleanroom work
- Basic cleanroom experience is a plus (lithography, deposition, or etching) is a plus
- Fluent in English, with strong written and verbal communication skills
- Curiosity and strong motivation to learn new fabrication techniques
- Attention to detail and experimental rigor
- Problem-solving mindset when working on process optimization
- Ability to work independently while collaborating with a technical team
- Interest in quantum device fabrication
Master 2 student in Microelectronics or Nanotechnology or Applied physics or Materials science or Microfabrication.
Hard skills:
Soft skills:
Benefits:
- 1 day off per month
- Half of transportation cost coverage (as per French law)
- Meal vouchers with Swile, as well as access to a fully equipped and regularly stocked kitchen
Research shows that women might feel hesitant to apply for this job if they don't match 100% of the job requirements listed. This list is a guide, and we'd love to receive your application even if you think you're only a partial match. We are looking to build teams that innovate, not just tick boxes on a job spec.
You will join of one of the most innovative startups in France at an early stage, to be part of a passionate and friendly team on its mission to build the first universal quantum computer!
We love to share and learn from one another, so you will be certain to innovate, develop new ideas, and have the space to grow.